Submission of Summary and Abstract

January 25, 2019

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Welcome to IPFA 2019

The International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) is Asia’s premier conference dedicated to IC failure analysis and reliability. 2019 marks its 26th edition and every year professionals, academic, suppliers, decision-makers, aspiring authors and world-class speakers congregate to share technology updates and address industry challenges. IPFA 2019 will feature an extensive program which includes:

  • Keynotes and Invited Talks
  • Tutorials and Workshops
  • Exhibition
  • Exchange Paper in FA and Reliability
  • Art of Failure Analysis Photo Contest

We cordially invite you to join us from the 02th-05th July at Hangzhou, China.

 

Announcements

Submission of Summary and Abstract

Prospective authors are requested to submit a two-page (at least) summary (includes text and figures) of their previously unpublished and original research work.

January 25, 2019

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Welcome to IPFA 2019

The 26th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2019) is organized by the IEEE RS/ EPS/ EDS Singapore Chapter, IEEE Electron Devices Society Hangzhou Chapter. The Symposium is technically co-sponsored by the IEEE Electron Device Society and IEEE Reliability Society.

July 2, 2019

Event Videos

IPFA 2018

IPFA 2017