Welcome to IPFA 2019
The International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) is Asia’s premier conference dedicated to IC failure analysis and reliability. 2019 marks its 26th edition and every year professionals, academic, suppliers, decision-makers, aspiring authors and world-class speakers congregate to share technology updates and address industry challenges. IPFA 2019 will feature an extensive program which includes:
- Keynotes and Invited Talks
- Tutorials and Workshops
- Exchange Paper in FA and Reliability
- Art of Failure Analysis Photo Contest
We cordially invite you to join us from the 02th-05th July at Hangzhou, China.
IPFA 2018 Best Paper in FA:
Characterization of Bandgap Engineering on Operative Transistor Devices by Spectral Photon Emission
by Anne Beyreuther1, Ivo Vogt1, Tomonori Nakamura2, Gerhard G. Fischer3, Babak Motamedi4 and Christian Boit1
1TU Berlin, Germany, 2Hamamatsu Photonics KK, Japan, 3IHP – Innovations for High Performance Microelectronics, Germany, 4Qualcomm Incorporated, USA
IPFA 2018 Best Paper in Reliability:
Self-heating Induced Variability and Reliability in Nanosheet-FETs Based SRAM”
by Wangyong Chen1, Linlin Cai1, Kunliang Wang1, Xing Zhang1,2, Xiaoyan Liu1and Gang Du1
1Institute of Microelectronics, Peking University, China, 2National Key Laboratory of Science and Technology on Micro/Nano Fabrication, China
IPFA 2018 Best Poster Paper in FA:
Plan-View to Cross-Section Conversion Work-Flow for Defect Analysis
Zdenek Kral and Trevan Landin
Thermo Fisher Scientific, USA
IPFA 2018 Best Poster Paper in Reliability:
Failure Analysis of a Degraded 1.2 kV SiC MOSFET after Short Circuit at High Temperature
Paula Diaz Reigosa, Francesco Iannuzzo and Lorenzo Ceccarelli
Aalborg University, Denmark
Submission of Summary and AbstractProspective authors are requested to submit a two-page (at least) summary (includes text and figures) of their previously unpublished and original research work.
February 28, 2019Read More
IPFA 2019 Abstract TemplateThe 26th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2019) is organized by the IEEE RS/ EPS/ EDS Singapore Chapter and the IEEE Electron Devices Society (EDS) Hangzhou Chapter, China. The Symposium is technically co-sponsored by the IEEE Electron Device Society and IEEE Reliability Society.
February 28, 2019Read More
Extension of Abstract DeadlineDue to the upcoming long Chinese New Year holidays in several Asian countries and request from several prospective authors, the deadline for abstract submission has been extended to FEBRUARY 28.
February 28, 2019
Welcome to IPFA 2019The 26th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2019) is organized by the IEEE RS/ EPS/ EDS Singapore Chapter, IEEE Electron Devices Society Hangzhou Chapter. The Symposium is technically co-sponsored by the IEEE Electron Device Society and IEEE Reliability Society.
July 2, 2019