Welcome to IPFA 2019
The International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) is Asia’s premier conference dedicated to IC failure analysis and reliability. 2019 marks its 26th edition and every year professionals, academic, suppliers, decision-makers, aspiring authors and world-class speakers congregate to share technology updates and address industry challenges. IPFA 2019 will feature an extensive program which includes:
- Keynotes and Invited Talks
- Tutorials and Workshops
- Exchange Paper in FA and Reliability
- Art of Failure Analysis Photo Contest
We cordially invite you to join us from the 02th-05th July at Hangzhou, China.
Regular Registration Rate Expires!Register by 20 June 2019 to enjoy the regular rate! More information here: http://www.ipfa-ieee.org/registration-fees/
June 20, 2019
Invitation Letter for Visa ApplicationIf visa is required, please send email to firstname.lastname@example.org to request for the invitation letter.
June 20, 2019
IPFA 2018 Best PaperTo view more on IPFA 2018 Best Paper, click on Read more
July 2, 2019Read More
Prasad Chaparala is the Director of Reliability Engineering at Amazon Lab126 in Sunnyvale, California. He is responsible for reliability engineering of a broad range of consumer electronic devices such as Echo smart speakers, Kindle e-readers, Fire tablets, and Fire TV products. Prior to this, he was the Vice President of Product and Reliability Engineering at…
Shimeng Yu is an associate professor of electrical and computer engineering at the Georgia Institute of Technology in Atlanta, Georgia. He received the B.S. degree in microelectronics from Peking University, Beijing, China in 2009, and the M.S. degree and Ph.D. degree in electrical engineering from Stanford University, Stanford, California, in 2011 and in 2013, respectively….