Submission of Summary and Abstract

January 25, 2019

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Welcome to IPFA 2019

The International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) is Asia’s premier conference dedicated to IC failure analysis and reliability. 2019 marks its 26th edition and every year professionals, academic, suppliers, decision-makers, aspiring authors and world-class speakers congregate to share technology updates and address industry challenges. IPFA 2019 will feature an extensive program which includes:

  • Keynotes and Invited Talks
  • Tutorials and Workshops
  • Exhibition
  • Exchange Paper in FA and Reliability
  • Art of Failure Analysis Photo Contest

We cordially invite you to join us from the 02th-05th July at Hangzhou, China.

 

IPFA 2018 Best Paper in FA:

Characterization of Bandgap Engineering on Operative Transistor Devices by Spectral Photon Emission

by Anne Beyreuther1, Ivo Vogt1, Tomonori Nakamura2, Gerhard G. Fischer3, Babak Motamedi4 and Christian Boit1

1TU Berlin, Germany, 2Hamamatsu Photonics KK, Japan, 3IHP – Innovations for High Performance Microelectronics, Germany, 4Qualcomm Incorporated, USA

IPFA 2018 Best Paper in Reliability:

Self-heating Induced Variability and Reliability in Nanosheet-FETs Based SRAM”

by Wangyong Chen1, Linlin Cai1, Kunliang Wang1, Xing Zhang1,2, Xiaoyan Liu1and Gang Du1

1Institute of Microelectronics, Peking University, China, 2National Key Laboratory of Science and Technology on  Micro/Nano Fabrication, China

IPFA 2018 Best Poster Paper in FA:

Plan-View to Cross-Section Conversion Work-Flow for Defect Analysis

Zdenek Kral and Trevan Landin

Thermo Fisher Scientific, USA

IPFA 2018 Best Poster Paper in Reliability:

Failure Analysis of a Degraded 1.2 kV SiC MOSFET after Short Circuit at High Temperature

Paula Diaz Reigosa, Francesco Iannuzzo and Lorenzo Ceccarelli

Aalborg University, Denmark

Announcements

Submission of Summary and Abstract

Prospective authors are requested to submit a two-page (at least) summary (includes text and figures) of their previously unpublished and original research work.

January 25, 2019

Read More

Welcome to IPFA 2019

The 26th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2019) is organized by the IEEE RS/ EPS/ EDS Singapore Chapter, IEEE Electron Devices Society Hangzhou Chapter. The Symposium is technically co-sponsored by the IEEE Electron Device Society and IEEE Reliability Society.

July 2, 2019

Event Videos

IPFA 2018

IPFA 2017