Welcome to IPFA 2019
The International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) is Asia’s premier conference dedicated to IC failure analysis and reliability. 2019 marks its 26th edition and every year professionals, academic, suppliers, decision-makers, aspiring authors and world-class speakers congregate to share technology updates and address industry challenges. IPFA 2019 will feature an extensive program which includes:
- Keynotes and Invited Talks
- Tutorials and Workshops
- Exchange Paper in FA and Reliability
- Art of Failure Analysis Photo Contest
We cordially invite you to join us from the 02th-05th July at Hangzhou, China.
Registration System Open!Early Bird Deadline: 30 May 2019
Check the Registration page for more details
May 30, 2019Read More
Invitation Letter for Visa ApplicationIf visa is required, please send email to email@example.com to request for the invitation letter.
June 20, 2019
IPFA 2018 Best PaperTo view more on IPFA 2018 Best Paper, click on Read more
July 2, 2019Read More