Colin Sheppard

Colin Sheppard is Honorary Professorial Fellow at the University of Wollongong, Australia. Previously, he has been Senior Scientist in the Nanophysics Department at the Italian Institute of Technology, Genoa; Professor in the Departments of Bioengineering, Biological Sciences and Diagnostic Radiology at National University of Singapore; Professor of Physics at the University of Sydney; and University Lecturer in Engineering Science at the University of Oxford. He obtained his PhD degree from University of Cambridge. He has held visiting positions at many universities, including MIT, Stanford, UC-Berkeley, EPFL, TU-Delft, University of Jena, University of Erlangen, UNSW, Melbourne, UWA, Queensland, Tsinghua, Zhejiang and Tokyo. He developed an early laser microscope (1975), patented scanning microscopy using Bessel beams (1977), gave the first demonstration of scanning two-photon microscopy (SHG) (1977), proposed two-photon fluorescence and CARS microscopy (1978), launched the first commercial confocal microscope (1982), and developed the first confocal microscope with computer control and storage (1983). In 1988, he proposed scanning microscopy using a detector array with pixel reassignment, now known as image scanning microscopy.

Keynote Abstract

Fundamental resolution limits in lithography and inspection

The classical fundamental limit to resolution in optical lithography and optical mask and wafer inspection is set by diffraction. The background to this fundamental limit is reviewed. Within this framework, solid immersion lenses, the proximity effect, phase-shifting masks, superoscillations, and the exploitation of partial coherence and nonlinearity are all approaches to improve upon the simple classical limit. Nowadays, it is usually regarded that it is not resolution itself that is limited, but the information capacity of the optical system. This means that resolution can be improved by trading off some other factor. Recent approaches to superresolution in microscopy may have applications in both optical lithography and optical inspection.

Muhammad (Ashraf) Alam

Professor Alam holds the Jai N. Gupta professorship at Purdue University, where his research focuses on the physics and technology of semiconductor devices. From 1995 to 2003, he was with Bell Laboratories,
Murray Hill, NJ, as a Member of Technical Staff in the Silicon ULSI Research Department. Since joining Purdue in 2004, Dr. Alam has published over 300 papers and has presented many invited and contributed talks. He is a fellow of IEEE, APS, and AAAS. His awards include the 2006 IEEE Kiyo Tomiyasu Medal for contributions to device technology and 2015 SRC Technical Excellence Award for fundamental contributions to reliability physics. Prof. Alam has made important contributions to graduate education — more than 125,000 students worldwide have learned some aspect of semiconductor devices from his web-enabled courses.

Keynote Abstract

Reliability Physics for  Post-Moore Era Electronics

In 1950s, one had to walk into a computer; today, we  carry a number of computers as we walk around. These Interface computers (e.g.  Google watch, Fitbits, Amazon echo) contain ultra-scaled transistors, variety of memories, MEMS microphones, bio-chemical sensors, energy harvesters, batteries, and so on.  In addition, the core computers at the datacenters run so hot that it is no longer inconceivable to think of  “clouds in a sea” i.e., computers immersed in sea-water to reduce self-heating.  The von-Neumann computing architecture  itself is expanding to include  neural networks, guided by the specialized needs of ecosystem companies, such as Amazon, LinkedIn, and eBay. I believe that  this sea-change in computing technology must be supported by a corresponding broadening of our focus on multi-component reliability physics. We must understand on equal footing the reliability physics of logic and power transistors, sensors, solar cells, and batteries (as well as the interaction between package and the ICs it encapsulates) and create a platform that predicts the integrated, system-level reliability.  I will use illustrative examples of self-heating in transistors, fluid-stability of biosensors, shadow/corrosion physics of solar cells, fatigue/stiction in MEMS,  ion-transport due to chip-package interaction to explain how a  new  generation of predictive reliability models will ensure  the reliability of post-Moore era electronics.