Call for Papers

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Call for Papers

The 26th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2019) is organized by the IEEE RS/ EPS/ EDS Singapore Chapter and the IEEE Electron Devices Society (EDS) Hangzhou Chapter, China. The Symposium is technically co-sponsored by the IEEE Electron Device Society and IEEE Reliability Society.

IPFA 2019 will be devoted to the fundamental understanding of the physical mechanisms governing reliability and failure in a large variety of advanced semiconductor devices and the electrical – physical failure analysis techniques, test methodologies, reliability models, simulations and characterization tools that could be used to reliably identify the root cause of failure and the lifetime of these devices under different stress regimes. Starting this year, we are expanding our focus on new topics relating to reliability and failure analysis of wide bandgap devices, non-volatile memory technologies (e-Flash, RRAM, STT-MRAM, etc.), photovoltaics as well as 2D materials and applications relating to these technologies in hardware security, counterfeit electronics, IoT, edge computing and neuromorphic systems.

The Technical Programme Committee is inviting papers related, but not limited to, the following areas:

  • Sample Preparation, Metrology and Defect Characterization
  • Die-Level / System-Level Failure Analysis Case Studies
  • Package Level Failure Analysis
  • Advanced Fault Isolation Techniques
  • Advanced Physical Failure Analysis Techniques
  • Emerging Topics in Failure Analysis
  • Transistor and NVM Device Reliability
  • Interconnect and Packaging Reliability
  • 2D Devices Reliability and Failure Analysis
  • Photovoltaic Device Reliability and Failure Analysis
  • High Power Electronics / Wide Bandgap Device Reliability and Failure Analysis

Within the track on “Emerging Topics in Failure Analysis”, we would like to welcome your submissions that look at the application or relevance of failure analysis methods and techniques to modern technology applications including hardware security, artificial intelligence, machine learning, photonics and deep learning hardware.

 

SUBMISSION GUIDELINES

Prospective authors are requested to submit a two-page (at least) summary (including text and figures) of their previously unpublished and original research work. The summary section of the submission should present the content of the submission according to the following sub-headings:

 

  1. Brief introduction to the background and motivation/objectives of the work.
  2. Experimental results, analysis and discussion.
  3. Summary of the findings, highlighting their impact, novelty and importance.
  4. Supporting figures, tables, and references.

 

AII submissions must be in English. The materials in the paper must be original and unpublished. Please submit the abstract according to the provided template and the abstract length is required to be at least 2 pages. Only electronic submissions in PDF format will be accepted.

Please limit your submission file size to 5 MB and submit your abstract through the IPFA Website http://www.ipfa-ieee.org by 25 January 2019, from which the provided template can be downloaded as well. For further details please contact the Technical Program Chair / Co-Chair.

Authors of papers that have been accepted for presentation will be notified by 29 March 2019. Upon notification of acceptance, authors will be asked to submit a final manuscript (mandatory and to be submitted by 24 May 2019) so that .it can be published in the Symposium Proceedings through IEEE Xplore.

 

IMPORTANT DATES

January 25th,2019

Submission of Summary and Abstract

March 29th,2019

Notification of Paper Acceptance

May 24th,2019

Submission of Final Manuscript

 

 

CONFERENCE CHAIRMAN

Juin J.Liou

Zhengzhou University

Email: juin.liou@hotmail.com

 

CO-CONFERENCE CHAIRMAN

Nagarajan Raghavan

Singapore University of Technology and Design

Email: nagarajan@sutd.edu.sg

 

TECHNICAL PROGRAM CHAIRMAN

Zhiwei Liu

University of Electronic Science and Technology of China

Email: ziv_liu@hotmail.com

 

CO-TECHNICAL PROGRAM CHAIRMAN

Wardhana A. Sasangka

Singapore-MIT Alliance for Research and Technology

Email: wardhana@smart.mit.edu

 

You Liu Wu

National Chi Nan University

Email: ylwu@ncnu.edu.tw