Registration

Registration Information

Registration fee: Includes attendance and materials for the tutorials and conference; and luncheons and tea breaks for 16 to 19 July 2018 and one banquet ticket for 18 July 2018. 10% discount for groups of 5 or more (same organization).

On or before

20 May 2018

After 20 May 2018 On or after

1 July 2018

IEEE Member

S$780

S$830

S$920

Non Member

S$980

S$1,050

S$1,150

Student

S$480

S$510

S$580

Register

TUTORIAL SESSIONS on 16 July 2018 (included in the registration fee)

REL 1 –  FinFET & Post-FinFET Advanced Logic Device Reliability– A Review
(Prof. Aaron Thean, NUS , Singapore)
FA 1 –  Perspectives of Fault Isolation and Technology Concepts for High Data Rate Ics
(Prof. Christian Boit, Technical University of Berlin, Germany)
REL 2 –  BEOL Reliability;  from FinFETs to More-than-Moore Device
(Dr. Jeff Gambino, ON Semiconductor , USA)
FA 2 –  SiP, Packaged Stacked Devices and other Challenging 3D Assembly Analysis
(Dr. Philippe Perdu, CNES, France)
FA 3 –  Focused Ion Beam (FIB) Chip Circuit Edit Tutorial
(Steven B. Herschbein, GLOBALFOUNDRIES, USA)
FA 4 –  Defect localization using SEM based current imaging
(Michél Simon-Najasek, IMWS, Germany)
REL 3 –  Intrinsic Reliability Challenges for Non-Volatile Memory Technologies
(Dr. Robin Degraeve, IMEC , Belgium)
FA 5 –  Physical Analysis with the TEM – Possibilities and Challenges
(Dr. Michel Bosman, IMRE, Singapore)
Evening Workshop on Electrical Fault Isolation

Authors and participants need to register online https://www.softconf.com/i/ipfa2018/ . For authors, your username and password are the same as the ones you used when you submitted the abstract.

Register