Dr. Philippe Perdu
Invited Talk Topic: Failure Analysis on Space Electronics: Best Practices, Challenges and Trends
Philippe Perdu is Senior Expert in microelectronics at CNES. He has led the VLSI Failure Analysis CNES laboratory since 1988. His main activity is to develop techniques and to adapt tools for electronic components dedicated to space applications. It mostly concerns FA process (defect localization).
His other activities are to provide support to space project (failure analysis at system / board / component level), to drive expertise roadmap (tooling) and to setup R&D programs related to VLSI expertise and reliability, to coach, train and supervise teams dedicated to these activities.
He holds an Electronic Specialty MS, Ph.D. and HDR (academic research supervisor). He has authored or co-authored more than 239 papers and 25 patents.
He chaired CCT MCE, a corporate network on electronic components and MEMS (2007 to 2011) and ANADEF, the French FA society (former president from 2005 to 2009, now secretary). He has been board member of EDFAS (Electron Device Failure Analysis Society), Organizing Committee member of ISTFA from 2005 to 2014 (Technical Chair in 2010, General Chair in 2012). He is still EUFANET (European Failure Analysis NETwork) board member, Associate Editor of EDFA Magazine, Editorial Advisory Board member of Miroelectronics Reliability and Steering Committee member of ESREF (Vice-Chair in 2015). He has participated in ESREF, ISTFA, IRPS, IPFA conferences as author, committee member and session chair.
He his doing research on optical testing (static and dynamic laser stimulation, laser probing and emission microscopy) and defect localization in 3D devices.
He is deeply involved in CNES / NTU cooperation and Adjunct Senior Principal Research Scientist at Temasek laboratories @ NTU since 2016 and Intraspec Technologies Scientific Advisor since 2011.
Tutorial Topic: SiP, Packaged stacked devices and other challenging 3D assembly analysis
3D devices technologies allow cost reduction, performance boost and more and more functionalities integration:
– Systems in Package (SiP) embed heterogeneous technologies (sensors, RF, power, analog, and digital);
– IC Manufacturers stack dies to target incredible storage (FLASH) or computation (FPGA) capacities while through Silicon Vias (TSV) open the door to very short and fast interconnections. In order to optimize design and process while assessing quality and reliability, failure analysis of failed part is a key to improve design and process as it gives the opportunity to set up efficient and cost effective corrective actions. Unfortunately, 3D Failure analysis is quite challenging. A third dimension has been added to what we previously had, optical access is very limited while 3D device complexity and heterogeneity trigger the need of having new specific approaches for these devices. Sample preparation is another challenge to access parts of the device to analyse while maintaining its electrical behaviour.
This tutorial will focus on 3D devices Failure Analysis defect isolation and localization. Only few physical principles can be used when we do not have direct optical access inside the device: thermal wave, electromagnetic field (magnetic field, reflectometry), X Ray and acoustic wave. Defect localization is done by techniques that link the abnormal electric behaviour (for instance short circuit) with a localized part. It can be completed by imaging tools able to pinpoint delamination, cracks (acoustic) or shorts and wide open (X-ray). These imaging techniques are also very useful along the FA process and can be enough for some basic failures.
I will give attendees a brief overview of chip access and some background on defect localization techniques, from physical principles to applications. It concerns Observation tools (Optical, Acoustic, X-Ray) and Tools and techniques directly correlated with electrical diagnosis (TDR and EOTPR, Thermography, Magnetic Microscopy). In addition, I will present Complementary or Emerging tools and techniques: TeraHertz Imaging, Thermoreflectance, Magneto-Optical Frequency Mapping (MOFM) …
Describing these techniques is not enough, it is important to learn if a specific technique is suitable regarding electrical diagnosis and to choose the most appropriate. These points will be inside the tutorial technique by technique and it will be summarized by brief guidelines to setup the best defect localization technique accordingly. This tutorial will end with a full 3D case study done in our lab