Speakers

Invited

Speakers

Cheryl Hartfield

Invited Talk Topic: From PCB to BEOL: 3D X-Ray Microscopy for Advanced Semiconductor Packaging

Cheryl Hartfield works for ZEISS as Solutions Manager for 3D X-ray microscopy. Cheryl co-founded Omniprobe, where she invented FIB lift-out methods and guided product development for TEM sample preparation.

She was a Sr. Member of Technical Staff at Texas Instruments, working for 12 years in characterization and package development.  She created FA solutions and led teams to solve CPI challenges of next node devices. Cheryl is an ASM Fellow, former ISTFA General Chair and Immediate Past President of the Electronic Device Failure Analysis Society. She holds >13 patents and has published >70 papers. She received BS and MS degrees in microbiology from Texas A&M and UT Southwestern Medical Center at Dallas.

Dr. Christine Hau

Invited Talk Topic: Electromigration Reliability of Solder Balls

Christine Hau-Riege has 18 years of experience in the semiconductor industry, focusing on device and package-level reliability.  Currently, she is a Principal Engineer in Qualcomm’s reliability team.  She has previously held similar positions at Intel and AMD.  She received her B.S. and Ph.D. degrees in the department of material science and engineering at MIT in 1996 and 2000, respectively.  She is also active in conferences such as IRPS and ECTC.  She is the first-author of about 20 publications and holds 19 US patents.

Dr. Giovanna Mura

Invited Talk Topic: From Automotive to Space qualification

Giovanna Mura received the M.Sc. Degree in Electronic Engineering from the University of Cagliari, Italy, in 2000.Subsequently, she joined the Reliability Laboratory (ReLab) of the Department of Electric and Electronic Engineering as PhD Student. She focused her work on Reliability and Failure Analysis of electronic devices.In 2004 she received the PhD. Degree in Electronic Engineering and Computer Science from the University of Cagliari. Since 2012 she is Assistant Professor in the Department of Electric and Electronic Engineering, University of Cagliari. She teaches Reliability of electronic systems and Diagnostic of electronic devices.

She was in the scientific committee of the past editions of the International Symposium on Reliability of Optoelectronics for Space applications (ISROS) specifically intended to investigate the physical reliability in harsh environment. She is in the technical programme committee of ESREF2018 (European Symposium on Reliability of Electron Devices, Failure Physics and Analysis ). Her research activity is mainly focused on failure physics, diagnostics of microelectronics by electron microscopy (SEM and TEM) and general methods for Reliability with a special emphasis on Photonic devices. She is author of more than sixty papers published on international journals or presented in at international conferences

Dr. Jeff Gambino

Invited Talk Topic: BEOL Reliability for More-than-Moore Devices

Dr. Gambino received the B.S. degree in materials science from Cornell University, Ithaca, NY, in 1979, and the PhD degree in materials science from the Massachusetts Institute of Technology, Cambridge, MA, in 1984.  He joined IBM in 1984.  While there, he worked on process integration and reliability for silicides, DRAM, copper interconnects, CMOS image sensors, RF devices, and Through-Silicon Vias.  He joined ON Semiconductor, Gresham, OR, in 2015.  He is currently working on process integration and reliability for CMOS image sensors and high voltage semiconductors. He has published over 200 technical papers and holds over 500 patents.

 

Dr. Jin Ju Kim

Invited Talk Topic: Reliability assessment of 10nm FinFET process technology.

Jin Ju Kim is senior quality and reliability engineer in Technology Q&R group, Foundry Business, Samsung Electronics in Korea since 2014. She is responsible for 10/14 FEOL reliability assessment which includes process evaluations, generating physical models for circuit reliability process design kit (PDK), and conducting process qualifications. She received Ph.D. degree in Nanobio Materials and Electronics from the Gwangju Institute of Science and Technology (GIST), Gwangju, Korea in 2014. She’s published more than 30 papers in the field of semiconductor and high-k reliability. Her research interest includes the physical reliability mechanism and modeling on high-k/metal gate stack technologies, as well as FinFET devices.

Dr. Liu Binghai

Invited Talk Topic: The Overview of the Impact of Electron Radiation on Semiconductor Failure Analysis by SEM, FIB and TEM

 

Binghai currently is a senior member of technical staff in product FA, Globalfoundries SGP. Before joining Globalfoundries SGP, he worked as the TEM facility manager in Center of Bioimaging Science in the National University of Singapore. Binghai has more than 20 years experience in TEM, and he has authored and co-authored more than 40 journal publications and around 20 conference papers in the field of semiconductor failure analysis and materials science.

Dr. Philippe Perdu

Invited Talk Topic: Failure Analysis on Space Electronics: Best Practices, Challenges and Trends

Philippe Perdu is Senior Expert in microelectronics at CNES. He has led the VLSI Failure Analysis CNES laboratory since 1988. His main activity is to develop techniques and to adapt tools for electronic components dedicated to space applications. It mostly concerns FA process (defect localization).

His other activities are to provide support to space project (failure analysis at system / board / component level), to drive expertise roadmap (tooling) and to setup R&D programs related to VLSI expertise and reliability, to coach, train and supervise teams dedicated to these activities.

He holds an Electronic Specialty MS, Ph.D. and HDR (academic research supervisor). He has authored or co-authored more than 239 papers and 25 patents.

He chaired CCT MCE, a corporate network on electronic components and MEMS (2007 to 2011) and ANADEF, the French FA society (former president from 2005 to 2009, now secretary). He has been board member of EDFAS (Electron Device Failure Analysis Society), Organizing Committee member of ISTFA from 2005 to 2014 (Technical Chair in 2010, General Chair in 2012). He is still EUFANET (European Failure Analysis NETwork) board member, Associate Editor of EDFA Magazine, Editorial Advisory Board member of Miroelectronics Reliability and Steering Committee member of ESREF (Vice-Chair in 2015). He has participated in ESREF, ISTFA, IRPS, IPFA conferences as author, committee member and session chair.

He his doing research on optical testing (static and dynamic laser stimulation, laser probing and emission microscopy) and defect localization in 3D devices.

He is deeply involved in CNES / NTU cooperation and Adjunct Senior Principal Research Scientist at Temasek laboratories @ NTU since 2016 and Intraspec Technologies Scientific Advisor since 2011.

 

Dr. Robin Degraeve

Invited Talk Topic: Opportunities and challenges of Resistive RAM for neuromorphic applications

Robin Degraeve is currently a Principal Scientist at imec, Belgium. He received the M.Sc. degree in electrical engineering from the University of Ghent, Belgium, in 1992 and the Ph.D. degree from KULeuven, Belgium, in 1998. In 1992, he joined imec, Leuven, in the Device Reliability and Characterization Group. His work has been focusing on the reliability aspects of thin insulating layers under electrical stress. His current research interests include the physics of degradation and breakdown phenomena in gate oxide films, the reliability of flash memory devices and the characterization and the reliability of high-k materials as gate insulators for future CMOS generations and memory applications. Later, he has been working mainly on Resistive RAM memory development and modeling. He is currently involved in the exploration of Resistive RAM for machine learning purposes.

 

Dr. Sergei P. Skorobogatov

Invited Talk Topic: Is Hardware Security prepared for unexpected discoveries?

Dr Sergei Skorobogatov is a Senior Research Associate at the University of Cambridge Computer Laboratory and a member of the Security Group. He has background in chemistry, electronics, physics and computer science. He received PhD degree in Computer Science from the University of Cambridge in 2005 and MSc degree in Physics in 1997. His research interests include hardware security analysis of smartcards, microcontrollers, FPGAs and ASICs.

Sergei pioneered optical fault injection attacks in 2001, which have influenced major rethink within semiconductor industry on the security protection of ICs and forced introduction of new evaluation procedures and countermeasures. Sergei’s previous research has substantially improved side-channel attacks and optical fault injection attacks. His recent research set new standards on data extraction from embedded EEPROM and Flash memory, while latest achievements demonstrated superior imaging capabilities of embedded memory. Sergei is a member of Program Committees at several major worldwide conferences on hardware security of semiconductor chips.

Frank Altmann

Invited Talk Topic: Failure Analysis Techniques for 3D Packages

Frank received his Diploma in Physics from the Technical University, Dresden. In 1997 he started at Fraunhofer as scientist for electron microscopy and FIB working on failure analysis for integrated circuits. Since 2006 he has been working as head of the research group »Diagnostics of semiconductor technologies« at the Fraunhofer Institute for Microstructure of Materials and Systems. His team is dealing with the development of novel techniques for focused ion beam sample preparation, SEM based current and active dopant contrast imaging and lock-in thermography defect localization. Furthermore, Frank works on advanced failure analysis techniques for 3D packages and holds patents for 3D LIT approaches. He has authored and co-authored more than 60 publications and is co-organizer of the European FIB Workshops EUFN and EFUG. Since 2012 he has been organizing the International CAM Workshop on Innovations in Failure Analysis and Material Diagnostics of Electronics Components. In 2016 he acted as technical program chair for the European Symposium on Reliability of Electron Devices, Failure Physics and Analysis Conference (ESREF).