Dr. Christian Schmidt
Invited Talk Topic: From PCB to BEOL: 3D X-Ray Microscopy for Advanced Semiconductor Packaging
Dr. Christian Schmidt received a diploma in physics technology and data information from the University of Applied Science Merseburg, in 2007 and the PhD degree in engineering from Martin-Luther University Halle-Wittenberg, Germany, in 2013.
From 2007 to 2012 he was a failure analysis engineer and research fellow at the Fraunhofer Institute for Mechanics of Materials, Halle Germany.He joined DCG Systems as SR. APPLICATION DEVELOPMENT ENGINEER in 2012 before he became a MEMBER OF TECHNICAL STAFF and later SR. SECTION MANAGER FOR PACKAGE FAILURE ANALYSIS at Globalfoundries Fab 8, Malta, New York.In 2016 he joined Carl Zeiss SMT as SOLUTIONS MANAGER FOR ADVANCED SEMICONDUCTOR PACKAGING.
He has authored over 30 publications including international conferences and journals and holds 3 patents. Dr. Schmidt has received the ISTFA Outstanding Paper Award in 2010 and the ECTC Best Paper Award in 2011.