Technical Committee

Technical Committee

Track 1: Sample Preparation, Metrology, and Defect Characterisation

Chair
Prof. Ralf Heiderhoff
Bergische Universitat Wuppertal, Germany
Co-Chair
Vinod Narang
AMD, Singapore
Dr. Chih Hang Tung
TSMC, Taiwan
Dr. Liu Qing
NTU, Singapore
Dr. Erwin Hendarto
Silabs, Singapore
Dr. Sam Subramanian
Freescale, USA
Prof. John Thong
NUS, Singapore

Track 2: Case Studies on Fault Isolation

Chair
Prof. Christian Boit
Technical University Berlin, Germany
Co-Chair
Dr. Alfred Quah
GLOBALFOUNDRIES, Singapore
Dr. Hirotoshi Terada
Hamamatsu, Japan
Dr. Szu Huat Goh
GLOBALFOUNDRIES, Singapore
Dr. Zhongling Qian
Infineon, USA
Amit Jakati
GLOBALFOUNDRIES, Singapore
Dr. Joshua Kevek
Intel, USA

Track 3: Case Studies on Physical Failure Analysis

Chair
Alan Street
On Semiconductor, China
Co-Chair
Dr. Ingrid De Wolf
IMEC, Belgium
Dr. James Lee
TSMC, Taiwan
Dr. Olivier Latry
University of Rouen Normandy, France
Dr. Eckhard Langer
GLOBALFOUNDRIES, Germany
Ruby Vollrath
Qualcomm, USA

Track 4: Package-Level Failure Analysis

Chair
Dr. Susan Li
Cypress, USA
Co-Chair
Jiann Min Chin
AMD, Singapore
Dr. Bernice Zee
AMD, Singapore
Dr. Wentao Qin
On Semiconductor, USA
Dr. Peter Jacob
EMPA, Switzerland
Dr. Yan Li
Intel, USA
Em Julius Dela Cruz
Maxim Integrated, Philippines
Dr. Liyi Li
Intel, USA

Track 5: Advanced Electrical Fault Isolation Techniques

Chair
Venkat Krishnan Ravikumar
AMD, Singapore
Prof. Phillippe Perdu
CNES, France
Mr. Kris Dickson
NXP, USA
Dr. Mike Bruce
Consultant, USA
Dr. Christopher Nemirow
Thermofisher, USA

Track 6: Advanced Physical Failure Analysis Techniques

Chair
Dr. Christian Hobert
GLOBALFOUNDRIES, Germany
Dr. Umberto Celano
IMEC, Belgium
Dr. Chen Changqing
GLOBALFOUNDRIES, SGP
Dr. Michael DiBattista
VarioScale, USA
Dr. Hongwen He
Hisilicon Technologies, China
Dr. Jayhoon Chung
Texas Instruments, USA

Track 7: Emerging Topics in Failure Analysis

Chair
Prof. Zhigang Ji
Liverpool John Moores University, UK
Co-Chair
Dr. Samuel Chef
NTU, Singapore
Dr. Cheryl Hartfield
ZEISS, USA
Dr. Wen Qiu
AMD, Singapore
Prof. Chee Lip Gan
NTU, Singapore
Prof. Hong Yang
IMECAS, China
Prof. Bin Gao
Tsinghua University, China
Prof. Sun Litao
Southeast University, China
Dr. Du Anyan
IMECAS, China
Dr. Changze Liu
Huawei Technologies, China

Track 8: Transistor and NVM Device Reliability

Chair
Prof. Runsheng Wang
Peking University, China
Co-Chair
Prof. Mario Lanza
Soochow University, China
Dr. Jim Stathis
IBM, USA
Dr. Jianfu Zhang
Liverpool John Moores University, UK
Dr. Shubhakar Kalya
SUTD, Singapore
Dr. Kaikai Xu
UESTC, China
Dr. Felix Palumbo
National Tech. University (UTN), Argentina
Dr. Tibor Grasser
TU Wien, Austria
Dr. Francesco Maria Puglisi
University of Modena, Italy
Dr. Horng-Chih Lin
NCTU, Taiwan
Dr. Enrique Miranda
UAB, Spain
Dr. Ming Liu
IMECAS, China
Dr. Mingxiang Wang
Soochow University, China
Dr. Erik Bury
IMEC, Belgium
Prof. Nagarajan Raghavan
Singapore University of Technology and Design, Singapore
Prof. Jiezhi Cheng
Shandong University, China
Prof. Meng Zhang
Shenzhen University, China
Dr. Chenkun Wang
Marvell Semiconductor Inc, USA
Prof. Wang Chao
Huazhong University of Science and Technology, China
Dr. Norhayati Soin
University of Malaya, Malaysia
Mr. Alok Ranjan
SUTD, Singapore
Prof. Liu Zhiwei
UESTC, China
Dr. Stanislav Tyaginov
TU Wien, Austria
Dr. Zheng Chai
Liverpool John Moores University, UK
Prof. Nilesh Goel
BITS Pilani Dubai Campus, India
Dr. Salvatore Lombardo
CNR-IMM, Italy
Dr. Narendra Parihar
IMEC, Belgium
Dr. Danny Shum
NXP Singapore, Singapore
Dr. Subhali Subhechha
IMEC, Belgium
Dr. Marco Villena
Soochow University, China
Prof. You-Lin Wu
National Chi Nan University, Taiwan
Prof. Wei Zhang
Liverpool John Moores University, UK

Track 9: Interconnect and Packaging Reliability

Chair
Dr. Jeffrey Gambino
ON Semiconductor, USA
Co-Chair
Prof. Rongxiang Wu
UESTC, China
Dr. Lim Yeow Kheng
STATSChipPAC, Singapore
Dr. Kristof Croes
IMEC, Belgium
Dr. Tam Lyn Tan
GLOBALFOUNDRIES, Singapore
Prof. Kuan-Neng Chen
NCTU, Taiwan
Dr. Wenqi Zhang
NCAP, China
Dr. Hajdin Ceric
TU Wien, Austria
Dr. Valeriy Sukharev
Mentor Graphics, USA
Dr. Wardhana A. Sasangka
Singapore-MIT Alliance for Research and Technology, Singapore
Dr. Christine Hau-Riege
Qualcomm, USA

Track 10: Photovoltaic Device Reliability and Failure Analysis

Dr. Zhang Li
Singapore-MIT Alliance for Research and Technology, Singapore
Prof. Kunal Mukherjee
University of California, Santa Barbara, USA
Prof. Arief Suriadi Budiman
SUTD, Singapore
Dr. Ariya Sangwongwanich
Aalborg University, Denmark
Prof. Rongshan Wei
Fuzhou University, China
Prof. Yang Xu
Zhejiang University, China
Dr. Andrew Tay
SUTD, Singapore
Dr. Kristof Croes
IMEC, Belgium

Track 11: High Power Electronics/Wide Bandgap Device Reliability and Failure Analysis

Chair
Prof. Min Ren
UESTC, China
Co-Chair
Dr. Wardhana A. Sasangka
Singapore-MIT Alliance for Research and Technology, Singapore
Prof. Francesco Iannuzo
Aalborg University, Denmark
Dr. Tian-Li Wu
National Chiao Tung University, Taiwan
Prof. Martin Kuball
University of Bristol, UK
Prof. Siyang Liu
Southeast University, China
Prof. Wangran Wu
Southeast University, China
Prof. Jinping Zhang
UESTC, China
Prof. Bhawani Shankar
Indian Institute of Science, India
Dr. Zhongling Qian
Infineon, Germany
Prof. Matteo Meneghini
University of Padova, Italy
Dr. Guoqiao Tao
Ampleon, Netherlands

Track 12: 2D Materials and Devices: Reliability and Failure Analysis

Chair
Prof. Yang Xu
Zhejiang University, China
Co-Chair
Dr. Wu Xing
ECNU, China
Dr. Wei Liang
GLOBALFOUNDRIES, USA
Prof. Kah Wee Ang
National University of Singapore (NUS), Singapore
Mr. Alok Ranjan
SUTD, Singapore
Dr. Fei Hui
Soochow University, China
Dr. Yuanyuan Shi
Technion-Israel Institute of Technology, China