Technical Committee

Technical Committee

Track 1: Sample Preparation, Metrology, and Defect Characterisation

Chair
Prof. Ralf Heiderhoff
Bergische Universitat Wuppertal, Germany
Co-Chair
Vinod Narang
Advanced Micro Devices, Singapore
Dr. Chih Hang Tung
Taiwan Semiconductor Manufacturing Co (TSMC), Taiwan
Dr. Liu Qing
Nanyang Technological University, Singapore
Dr. Erwin Hendarto
Silicon Labs
Dr. Sam Subramanian
Freescale, USA
Dr. Terence Kane
IBM, USA
Prof. John Thong
National University of Singapore, Singapore
Dr. Gregory Johnson
GlobalFoundries, USA
Dr. Hans-J├╝rgen Engelmann
GlobalFoundries, Germany

Track 2: Case Studies on Fault Isolation

Chair
Prof. Christian Boit
Technical University Berlin, Germany
Co-Chair
Alfred Quah
GlobalFoundries, Singapore
Dr. Lavakumar
Qualcomm, USA
Dr. Hirotoshi Terada
Hamamatsu, Japan
Dr. Christian Schmidt
Carl Zeiss, USA
Dr. Szu Huat Goh
GlobalFoundries, Singapore
Dr. Zhongling Qian
Infineon, USA
Dr. Amit Jakati
GlobalFoundries, USA
Dr. Dave Vallet
Peak Source Analyitical, USA

Track 3: Case Studies on Physical Failure Analysis

Chair
Alan Street
HUAWEI, China
Co-Chair
Dr. Ingrid De Wolf (CoChair)
IMEC, Belgium
Dr. James Lee
TSMC, Taiwan
Dr. Olivier Latry
University of Rouen Normandy, France
Dr. Sebastian Brand
Fraunhofer Insititute for Microstrucutre of Materials & Systems, Germany
Dr. Shuichi Kudo
Renesas Electronics, Japan
Dr. Eckhard Langer
GlobalFoundries, Germany
Dr. Brendan Foran
Aerospace Corporation, USA
Dr. Jane Li
NVIDIA, USA
Dr. Li Lung Lai
SMIC, China
Ruby Vollrath
Qualcomm, USA
Nebojsa Jankovik
NXP, Netherlands

Track 4: Package-Level Failure Analysis

Chair
Dr. Susan Li
Cypress, USA
Co-Chair
Jiann Min Chin
Advanced Micro Devices, Singapore
Dr. Bernice Zee
Advanced Micro Devices, Singapore
Dr. Wentao Qin
On Semiconductor, USA
Dr. Mario Pacheco
Intel, USA
Dr. Herve Deslandes
DCG Systems, USA
Dr. Peter Jacob
EMPA, Switzerland
Dr. Yu-Hua Chen
Unimicron, Taiwan
Dr. Yan Li
Intel, USA
Patrick Pardy
Intel, USA
Em Julius Dela Cruz
Maxim Integrated, Philippines
Jerome Escobedo
Maxim Integrated, Philippines

Track 5: Advanced Electrical Fault Isolation Techniques

Chair
Dr. Phillippe Perdu
CNES, France
Co-Chair
Venkat Krishnan Ravikumar
Advanced Micro Devices, Singapore
Dr. Keith Serrels
NXP, USA
Kris Dickson
NXP, USA
Dr. Mike Bruce
Consultant, USA
Dr. Christopher Nemirow
Thermofisher, USA
Dr. Rudolf
NVDIA, USA
Dr. Baohua Niu
TSMC, Taiwan
Dr. Samuel Chef
NTU, Singapore

Track 6: Advanced Physical Failure Analysis Techniques

Chair
Dr. Christian Hobert
GlobalFoundries, Germany
Chair
Dr. Michel Bosman
IMRE, Singapore
Co-Chair
Dr. Wu Xing
ECNU, China
Dr. William E. Vanderlinde
IARPA, USA
Dr. Umberto Celano
IMEC, Belgium
Dr. David Su
TSMC, Taiwan
Dr. Chen Changqing
GlobalFoundries, Singapore
Dr. CY Liu
MATek, Taiwan
Dr. Du Anyan
TSMC, Taiwan
Dr. Michael DiBattista
VarioScale, USA
Dr. Hongwen He
Hisilicon Technologies, China
Dr. Jayhoon Chung
Texas Instruments, USA
Bryan Tracy
EAG, USA

Track 7: Device Reliability

Chair
Prof. Nagarajan Raghavan
Singapore University of Technology and Design, Singapore
Co-Chair
Prof. Mario Lanza
Soochow University, China
Dr. Jim Stathis
IBM, USA
Dr. Jianfu Zhang
Liverpool John Moores University, UK
Dr. Shubhakar Kalya
Singapore University of Technology and Design, Singapore
Dr. Guoqiao Tao
Philips, Netherlands
Dr. Kaikai Xu
UESTC, China
Dr. Felix Palumbo
National Tech. University (UTN), Argentina
Dr. Tian-Li Wu
National Chiao Tung University, Taiwan
Dr. Tibor Grasser
TU Wien, Austria
Dr. Francesco Maria Puglisi
University of Modena, Italy
Prof. Ru Huang
PKU, China
Dr. Horng-Chih Lin
NCTU, Taiwan
Dr. Enrique Miranda
UAB, Spain
Dr. Ming Liu
IMECAS, China
Dr. Mingxiang Wang
Soochow University, China
Dr. Ben Kaczer
IMEC, Belgium

Track 8: Interconnect and Packaging Reliability

Chair
Dr. Wardhana A. Sasangka
Singapore-MIT Alliance for Research and Technology, Singapore
Co-Chair
Dr. Lim Yeow Kheng
STATSChipPAC, Singapore
Dr. Jeffrey Gambino
ON Semiconductor, USA
Dr. Kristof Croes
IMEC, Belgium
Prof. Arief Suriadi Budiman
Singapore University of Technology and Design, Singapore
Prof. Cher Ming Tan
Chang Gung University, Taiwan
Prof. Renrong Liang
Tsinghua University, China
Prof. Chee Lip Gan
Nanyang Technological University, Singapore
Dr. Tam Lyn Tan
GlobalFoundries, Singapore
Prof. Kuan-Neng Chen
NCTU, Taiwan
Dr. Wenqi Zhang
NCAP, China
Dr. Joel L. Plawsky
Renseelaer Polytechnic, USA
Prof. Mariappan Murugesan
Tohoku University, Japan
Dr. Hajdin Ceric
TU Wien, Austria
Dr. Hai Liu
Samsung Semiconductors, China
Prof. Christian Ehrhardt
TU Berlin, Germany
Prof. Sheldon Tan
UC Riverside, USA
Dr. Valeriy Sukharev
Mentor Graphics, USA
Prof. Young Chang Joo
Seoul National University, South Korea
Prof. Young Bae Park
Andong University, South Korea
Dr. Choi Won Kyoung
STATSCHipPAC, Singapore
Prof. Chan Yan Cheong
City University of Hongkong, Hongkong
Prof. Chuan Seng Tan
Nanyang Technological University, Singapore
Dr. Christine Hau-Riege
Qualcomm, USA