Welcome to IPFA 2020
The 27th edition of the IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2020) will be held at the Marina Bay Sands Convention Center in Singapore from July 20-23. IPFA will continue to focus on the fundamental understanding of the electrical and physical characterization techniques and associated technologies that assist in probing the nature of wear-out and failure in conventional and new CMOS devices, in turn resulting in improved knowhow of the physics of device / circuit / module failure that serves as critical input for future design for reliability. We are also soliciting submissions in new and upcoming areas of research that include failure analysis for hardware security, reliability and failure analysis of power electronics, PV technologies as well as 2D Nanodevices and applications of machine learning and AI to the field of failure analysis and reliability assessment.
IPFA 2020 – 27th International Symposium on the Physical and Failure Analysis of Integrated Circuits
Dates: 20-23 July 2020
Venue: Marina Bay Sands Expo and Convention Center
Draft Full Paper Submission DueThank you for your submission to IPFA 2020. The paper acceptance announcement has been sent to your registered emails. If you have not received it, please send an email to email@example.com.
Please also note that the draft full manuscript should be submitted by April 30, 2020.
April 30, 2020Read More
Keynote Speaker 1: Professor Aaron Thean
Keynote Topic: Flexible electronics and its associated reliability and technology challenges Professor Aaron Thean graduated from University of Illinois at Champaign-Urbana, USA, where he received his B.Sc. (Highest Honours), M.Sc., and Ph.D. in Electrical Engineering (Edmund J. James Scholar). He has published over 300 technical papers and holds more than 50 US patents. Prof Thean joined the…