Abstract submission is open

February 8, 2020

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Welcome to IPFA 2020

The 27th edition of the IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2020) will be held at the Marina Bay Sands Convention Center in Singapore from July 20-23. IPFA will continue to focus on the fundamental understanding of the electrical and physical characterization techniques and associated technologies that assist in probing the nature of wear-out and failure in conventional and new CMOS devices, in turn resulting in improved knowhow of the physics of device / circuit / module failure that serves as critical input for future design for reliability. We are also soliciting submissions in new and upcoming areas of research that include failure analysis for hardware security, reliability and failure analysis of power electronics, PV technologies as well as 2D Nanodevices and applications of machine learning and AI to the field of failure analysis and reliability assessment.

 

IPFA 2020 – 27th International Symposium on the Physical and Failure Analysis of Integrated Circuits

Dates: 20-23 July 2020

Venue: Marina Bay Sands Expo and Convention Center

 

Call for Papers

Announcements

Abstract submission is open

Abstract Submission: 1 December 2019 - 8 February 2020

February 8, 2020

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Event Videos

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IPFA 2018