Keynote Speaker 1: Professor Aaron Thean

Keynote Topic: Flexible electronics and its associated reliability and technology challenges

Professor Aaron Thean graduated from University of Illinois at Champaign-Urbana, USA, where he received his B.Sc. (Highest Honours), M.Sc., and Ph.D. in Electrical Engineering (Edmund J. James Scholar).  He has published over 300 technical papers and holds more than 50 US patents.

Prof Thean joined the Department of Electrical and Computer Engineering at the National University of Singapore (NUS) in May 2016. He is currently the Dean of NUS Engineering and Director of the NUS HiFES programme. In addition, he also holds several technical leadership responsibilities at the University, which includes A*STAR SIMTech-NUS Joint Laboratory for Large-Area Flexible Hybrid Electronics, Co-Director of Applied Materials–NUS Advanced Materials Corporate Lab, and Director of NUS Engineering’s micro-nanofabrication research centre, E6NanoFab. From 2016 to 2018, he was also the Director of Industry Engagement & Partnerships in the Office of the Deputy President (Research and Technology).

Prior to NUS, Prof Thean was with IMEC, Qualcomm and IBM. As a Vice President of Logic Technologies at IMEC, he has worked with leaders in the semiconductor industry like Intel, TSMC, Samsung, Globalfoundries, Apple, and Sony, as well as directed the research and development of next-generation semiconductor technologies and emerging nano-device architectures.

More recently, Prof Thean was recognised as Singapore National Research Foundation’s Returning Singaporean Scientist. Active in local and international advanced electronics communities, Prof Thean is an Editor of the IEEE Electron Device Letters and he serves on several Scientific Advisory Boards that include Singapore-MIT Alliance (SMART-LEES), A*STAR Institute of Microelectronics (IME), Huawei Singapore Research Centre, and he is Consulting Fellow to IMEC CEO.

Prof Aaron’s research interests span co-design of novel electronic material, components, circuits and form-factor.