Technical Committee

Technical Committee

Track 1: Emerging Topics in Failure Analysis and Reliability

Chair
Dr. Francesco Maria Puglisi
University of Modena, Italy
Co-Chair
Dr. Samuel Chef
NTU, Singapore
Dr. Cheryl Hartfield
ZEISS, USA
Dr. Wen Qiu
AMD, Singapore
Prof. Chee Lip Gan
NTU, Singapore
Prof. Hong Yang
IMECAS, China
Prof. Bin Gao
Tsinghua University, China
Dr. Changze Liu
Huawei Technologies, China
Prof. Navid Asadizanjani
University of Florida, USA
Dr. Erik Bury
IMEC, Belgium

Track 2: Product Test and Diagnostic

Chair
Dr. Szu Huat Goh
GLOBALFOUNDRIES, Singapore
Co-Chair
Mr. Venkat Krishnan Ravikumar
AMD, Singapore
Mr. Dennis Wee
NXP, Singapore
Mr. Leng Koon Goh
Advantest, Singapore
Mr. Jayant Dsouza
Mentor, USA

Track 3: Photonics Device (Display, lighting and Photovoltaic) Reliability and Failure Analysis

Chair
Dr. Yufeng Dai
Huawei Technologies, China
Co-Chair
Dr. Zhang Li
Singapore-MIT Alliance for Research and Technology, Singapore
Prof. Arief Suriadi Budiman
SUTD, Singapore
Prof. Massimo Vanzi
Cagliari University, Italy
Dr. Qiang Wang
Huawei Technologies, USA
Dr. Jin Wah Ronnie Teo
SIMTECH A*STAR, Singapore
Prof. Cher Ming Tan
Chang Gung University, Taiwan

Track 4: Sample Preparation, Metrology and Defect Characterization

Chair
Dr. Erwin Hendarto
Silicon Labs, USA
Co-Chair
Vinod Narang
AMD, Singapore
Dr. Chih Hang Tung
TSMC, Taiwan
Dr. Liu Qing
NTU, Singapore
Prof. Ralf Heiderhoff
Bergische Universitat Wuppertal, Germany
Dr. Sam Subramanian
Freescale, USA
Prof. John Thong
NUS, Singapore
Dr. Zhu Jie
GLOBALFOUNDRIES, Singapore
Dr. Govindo J Syaranamual
Carl Zeiss Pte. Ltd., Singapore
Ms Zheng Xinhua
NYP, Singapore
Dr. Ramesh Rao Nistala
GLOBALFOUNDRIES, Singapore
Dr. Ed Principe
Synchrotron Research, Inc., USA
Mr. Roger Alvis
Thermo Fisher Scientific, USA
Dr. Vignesh Viswanathan
Carl Zeiss, Singapore

Track 5: Case Studies on Fault Isolation

Chair
Prof. Christian Boit
Technical University Berlin, Germany
Co-Chair
Dr. Alfred Quah
GLOBALFOUNDRIES, Singapore
Dr. Hirotoshi Terada
Hamamatsu, Japan
Dr. Zhongling Qian
Infineon, USA
Mr. Amit Jakati
Samsung Electronics, USA
Dr. Joshua Kevek
Intel, USA
Dr. Song Zhigang
IBM, USA
Dr. Tsao Chun-Cheng
Thermo Fisher Scientific, Taiwan
Mr. Brandon Scott
Cirrus Logic, USA
Ms Angeline Phoa
AMD, Singapore
Mr. William Lo
Nvidia, USA
Dr. Guillaume Bascoul
CNES, France
Mr. Michél Simon-Najasek
IMWS, Germany
Dr. Samuel Chef
NTU, Singapore
Mr. Greg Johnson
Carl Zeiss, USA

Track 6: Case Studies on Physical Failure Analysis

Chair
Alan Street
On Semiconductor, China
Co-Chair
Dr. Eckhard Langer
GLOBALFOUNDRIES, Germany
Dr. James Lee
TSMC, Taiwan
Ms Ruby Vollrath
Qualcomm, USA
Mr Pik Kee Tan
GLOBALFOUNDRIES, Singapore
Ms Rose Ring
Lam Research, USA
Mr Soon Huat Lim
AMD, Singapore
Mr. Wilson Lee
Qualcomm, Singapore
Prof. Olivier Latry
University of Rouen Normandy, France
Mr. Wang Bisheng
Huawei Technologies, China

Track 7: Package-Level Failure Analysis

Chair
Ms Susan Li
Cypress, USA
Co-Chair
Mr. Jiann Min Chin
AMD, Singapore
Dr. Bernice Zee
AMD, Singapore
Dr. Peter Jacob
EMPA, Switzerland
Dr. Yan Li
Intel, USA
Mr. Em Julius Dela Cruz
Maxim Integrated, Philippines
Mr. Frank Altmann
IMWS, Germany
Dr. Lihong Cao
ASE Group - ASE (U.S.) INC., USA
Dr. Liyi Li
Intel, USA
Dr. Shang Yang
Advantest, Singapore

Track 8: Advanced Electrical Fault Isolation Techniques

Chair
Mr. Venkat Krishnan Ravikumar
AMD, Singapore
Co-Chair
Mr. Kris Dickson
NXP, USA
Prof. Phillippe Perdu
CNES, France
Dr. Mike Bruce
Consultant, USA
Dr. Christopher Nemirow
Nvidia, USA
Dr. Franco Stellari
IBM, USA
Dr. Szu Huat Goh
GLOBALFOUNDRIES, Singapore

Track 9: Advanced Physical Failure Analysis Techniques

Chair
Dr. Christian Hobert
GLOBALFOUNDRIES, Germany
Co-Chair
Dr. Binghai Liu
Wintech, Singapore
Dr. Umberto Celano
IMEC, Belgium
Dr. Chen Changqing
GLOBALFOUNDRIES, SGP
Dr. Michael DiBattista
VarioScale, USA
Dr. Hongwen He
Hisilicon Technologies, China
Dr. Jayhoon Chung
Texas Instruments, USA
Dr. Michel Bosman
NUS A*STAR IMRE, Singapore
Mr. Steven B. Herschbein
GLOBALFOUNDRIES, USA

Track 10: Transistor and NVM Reliability

Chair
Prof. Runsheng Wang
Peking University, China
Co-Chair
Prof. Mario Lanza
Soochow University, China
Dr. Jim Stathis
IBM, USA
Dr. Jianfu Zhang
Liverpool John Moores University, UK
Dr. Shubhakar Kalya
SUTD, Singapore
Dr. Felix Palumbo
National Tech. University (UTN), Argentina
Dr. Tibor Grasser
TU Wien, Austria
Dr. Horng-Chih Lin
NCTU, Taiwan
Dr. Enrique Miranda
UAB, Spain
Prof. Nagarajan Raghavan
Singapore University of Technology and Design, Singapore
Prof. Jiezhi Cheng
Shandong University, China
Dr. Stanislav Tyaginov
IMEC, Belgium
Dr. Zheng Chai
Liverpool John Moores University, UK
Dr. Narendra Parihar
IMEC, Belgium
Dr. Danny Shum
NXP Singapore, Singapore
Dr. Subhali Subhechha
IMEC, Belgium
Prof. Wei Zhang
Liverpool John Moores University, UK
Prof. Zhigang Ji
Jiao Tong University, China
Dr. Xinfei Guo
Univerity of Virginia, USA

Track 11: ESD, Latchup and Reliability for Space Applications

Chair
Dr. Steven H. Voldman LLC
Consultant, USA
Co-Chair
Dr. Mingxiang Wang
Soochow University, China
Dr. Natarajan Mahadeva Iyer
Allegro Systems, USA
Dr. Milova Paul
GLOBALFOUNDRIES, Singapore
Dr. Marko Simicic
IMEC, Belgium
Dr. Harald Gossner
Intel, USA
Prof. Chun-Yu Lin
NTNU, Taiwan

Track 12: Interconnect and Packaging Reliability

Chair
Dr. Jeffrey Gambino
ON Semiconductor, USA
Co-Chair
Dr. Lim Yeow Kheng
STATSChipPAC, Singapore
Dr. Kristof Croes
IMEC, Belgium
Dr. Tam Lyn Tan
GLOBALFOUNDRIES, Singapore
Dr. Wenqi Zhang
NCAP, China
Dr. Hajdin Ceric
TU Wien, Austria
Dr. Valeriy Sukharev
Mentor Graphics, USA
Dr. Christine Hau-Riege
Qualcomm, USA
Dr. Andrew Tay
SUTD, Singapore

Track 13: High Power Electronics/Wide Bandgap Device Reliability and Failure Analysis

Chair
Dr. Tian-Li Wu
National Chiao Tung University, Taiwan
Co-Chair
Dr. Wardhana A. Sasangka
Singapore-MIT Alliance for Research and Technology, Singapore
Prof. Siyang Liu
Southeast University, China
Prof. Wangran Wu
Southeast University, China
Prof. Jinping Zhang
UESTC, China
Prof. Bhawani Shankar
Indian Institute of Science, India
Prof. Martin Kuball
University of Bristol, UK
Prof. Matteo Meneghini
University of Padova, Italy
Dr. Guoqiao Tao
Ampleon, Netherlands
Prof. Meng Zhang
Shenzhen University, China
Prof. Francesco Iannuzo
Aalborg University, Denmark

Track 14: 2D Materials and Devices: Reliability and Failure Analysis

Chair
Dr. Fei Hui
Technion-Israel Institute of Technology, Israel
Co-Chair
Dr. Alok Ranjan
SUTD, Singapore
Dr. Wei Liang
GLOBALFOUNDRIES, USA
Prof. Kah Wee Ang
National University of Singapore (NUS), Singapore
Dr. Yuanyuan Shi
IMEC, Belgium
Prof. Yang Xu
Zhejiang University, China
Dr. Wu Xing
ECNU, China
Dr. Chundong Liang
Micron, USA