Welcome to IPFA 2022 (HYBRID)

The 29th edition of the IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2022) is going hybrid with the live event coming to Marina Bay Sands, Singapore. IPFA will continue to focus on the fundamental understanding of the electrical and physical characterization techniques and associated technologies that assist in probing the nature of wear-out and failure in conventional and new CMOS devices, in turn resulting in improved knowhow of the physics of device / circuit / module failure that serves as critical input for future design for reliability. Conference details and Call for Papers are as follows.

In-Person Conference : 18th – 20th July, 2022       Advanced Technical Program

Venue : Marina Bay Sands, Singapore

Virtual Conference : 3rd August – 2nd September 2022 (Whova)

 

* Your safety and well-being is our first priority ! Prevailing meeting, conference and exhibition event Safe Management Measures will be closely monitored and followed.

 

For information related to travelling to Singapore – Click here

 

Announcements

IPFA 2022 IN-PERSON CONFERENCE TECHNICAL PROGRAM

Browse through the Advance Technical program of the IPFA 2022 In-Person Conference

July 18, 2022

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Japanese Biggest Symposium on Test and FA

Call for Paper for NANO Testing Symposium

July 29, 2022

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Keynote Speakers

Keynote 1 : Towards CMOS/2D Hybrid Microchips

Speaker : Professor Mario Lanza

King Abdullah University of Science and Technology (KAUST), Saudi Arabia

Two-dimensional layered materials (2D-LMs) have outstanding physical, chemical and thermal properties that make them attractive for the fabrication of solid-state micro/nano-electronic devices and circuits. However, synthesizing high-quality 2D-LMs at the wafer scale is difficult, and integrating them in semiconductor production lines brings associated multiple challenges. Read More..

Keynote 2 : Reliable Electronics Skins?

Speaker : Professor Benjamin C.K. Tee

National University of Singapore, Singapore

The hyper-connected environment where humans, smart devices and robots live in synergy together could be realized within the next decade. Flexible, wearable sensors and systems are rapidly progressing in various possible use cases for health, consumer electronics and robotics. These skin-like devices require significant reliability performances in order to continue operating despite being Read More..

Event Videos

IPFA 2019

IPFA 2018