Welcome to IPFA 2022 (HYBRID)
The 29th edition of the IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2022) is going hybrid with the live event coming to Marina Bay Sands, Singapore. IPFA will continue to focus on the fundamental understanding of the electrical and physical characterization techniques and associated technologies that assist in probing the nature of wear-out and failure in conventional and new CMOS devices, in turn resulting in improved knowhow of the physics of device / circuit / module failure that serves as critical input for future design for reliability. Conference details and Call for Papers are as follows.
In-Person Conference : 18th – 20th July, 2022
Venue : Marina Bay Sands, Singapore
Virtual Conference : 3rd August – 2nd September 2022 (Whova)
* Your safety and well-being is our first priority ! Prevailing meeting, conference and exhibition event Safe Management Measures will be closely monitored and followed.
For information related to travelling to Singapore – Click here
Early Bird Registration is Open Now !Plan and attend IPFA 2022, the Largest FA & Reliability Event in Asia.
Register by 23 May 2022 to enjoy early bird discount.
May 23, 2022Read More
ART of FAShowcase your FA photos with striking resemblance to real life occurrences to win attractive cash prizes!!!
June 15, 2022Read More
Keynote 1 : Towards CMOS/2D Hybrid Microchips
Speaker : Professor Mario Lanza
King Abdullah University of Science and Technology (KAUST), Saudi Arabia
Two-dimensional layered materials (2D-LMs) have outstanding physical, chemical and thermal properties that make them attractive for the fabrication of solid-state micro/nano-electronic devices and circuits. However, synthesizing high-quality 2D-LMs at the wafer scale is difficult, and integrating them in semiconductor production lines brings associated multiple challenges. Read More..
Keynote 2 : Reliable Electronics Skins?
Speaker : Professor Benjamin C.K. Tee
National University of Singapore, Singapore
The hyper-connected environment where humans, smart devices and robots live in synergy together could be realized within the next decade. Flexible, wearable sensors and systems are rapidly progressing in various possible use cases for health, consumer electronics and robotics. These skin-like devices require significant reliability performances in order to continue operating despite being Read More..