Welcome to IPFA 2022

IPFA 2022 is going hybrid

Start planning to attend today!


The 29th edition of the IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2022) is going hybrid with the live event coming to Marina Bay Sands, Singapore. IPFA will continue to focus on the fundamental understanding of the electrical and physical characterization techniques and associated technologies that assist in probing the nature of wear-out and failure in conventional and new CMOS devices, in turn resulting in improved knowhow of the physics of device / circuit / module failure that serves as critical input for future design for reliability. We are also soliciting submissions in new and upcoming areas of research that include failure analysis for hardware security, applications of machine learning and AI to the field of failure analysis and reliability, failure analysis and reliability of power electronics, photonics devices as well as 2D Nanodevices.

Dates: 18th – 21st July, 2022

Venue : Marina Bay Sands, Singapore


IPFA 2022 Second Call For Paper Download

IPFA 2022 国际会议征集论文 Download


For further information on Abstract submission click here



* Your safety and well-being is our first priority ! Prevailing meeting, conference and exhibition event Safe Management Measures will be closely monitored and followed.


For latest information on travel advisory from Singapore Government  https://safetravel.ica.gov.sg/health


Event Videos

IPFA 2019

IPFA 2018