FA4.0 – Create Prerequisites and Applications for AI-Solutions in Innovative Tools of Failure Analysis
The project FA4.0, which is running in the European EUREKA-funded Clusters EURIPIDES2 / PENTA, offers a comprising approach to foster Read More..
PlasmaiFocused Ion Beam for Hardware Analysis: Sample Preparation
With the development of intelligence and the increase in chip market demand, the density of the chips is getting higher while fabrication technology Read More..
Radiation-Induced Failures for Integrated Circuits in Space and Design Philosophy
Reliability of Integrated Circuits (ICs) operating in space is extremely critical and however challenging. As repairs or replacement of electronics/ICs Read More..
Workflowsiand Challenges in 3D Package Failure Analysis
The complex architecture and the high-level functional integration in 3D packages produce considerable challenges for Fault Isolation (FI) and Failure analysis (FA) methods. Non-destructive and high-resolution FI Read More..
SubmicroniNanosecond Thermal Imaging using Thermoreflectance for Failure Analysis
Shrinking feature sizes and transitions towards 3D packages and devices has significantly increased the difficulty for failure analysis Read More..
ChainoDiagnosis as a Tool for Yield Ramp in Advanced Process Nodes
Scan chains form a critical part of the test structures on digital designs. Chain diagnosis is commonly used in early yield ramp to root cause process issues. Recent advancements in chain Read More..
TheiICiUltra-Thin Back Surface – A Field of Real Nanoscale Fault Isolation Opportunities Requiring A Skillful Sample Preparation
The backside approach of contactless fault isolation (CFI) was comfortable as long as it could be carried out Read More..
Reliableomemristive switching in low-dimensional materials based nanomemristors
With the shrinking of electronic devices, low-dimensional materials (e.g. 2D h-BN, 1D nanowires) have been utilized as a switching layer in memristive devices with a metal/insulator/metal Read More..
FlexibleoStretchable Conductors for Soft or Hybrid Electronics
Stretchable electronics are expected to function under mechanical deformation that makes them attractive in healthcare technology, Read More..
Ga2O3aandaGa2O3 – Diamond For Next Generation Power Electronics
Ga2O3, with its ultra-wide bandgap and melt-grown substrates, offers the potential for low-cost >1 kV electronics. However, numerous challenges need to be overcome, in particular Read More..