Track 1: AI for Failure Analysis and Reliability

Chair
Dr. Francesco Puglisi
University of Modena and Reggio Emilia, Italy
Co-Chair
Dr. Franco Stellari
IBM Corporation, USA
Prof. Li Yiming
National Chiao Tung University, Taiwan
Dr. Samuel Chef
Nanyang Technological University, Singapore
Prof. Nagarajan Raghavan
Singapore University of Technology and Design, Singapore
Dr. Liu Changze
Huawei Technologies, China
Prof. Gao Bin
Tsinghua University, China
Dr. Goh Szu Huat
Qualcomm, Singapore

Track 2: Sample Preparation, Metrology and Defect Characterization

Chair
Dr. Erwin Hendarto
Silicon Labs, USA
Co-Chair
Dr. Chua Chung Tah
Nanyang Technological University, Singapore
Dr. Liu Qing
Nanyang Technological University, Singapore
Prof. Ralf Heiderhoff
Bergische Universitat Wuppertal, Germany
Ms. Zheng Xinhua
Nanyang Polytechnic, Singapore
Dr. Vignesh Viswanathan
Carl Zeiss, Singapore
Dr.Sam Subramanian
NXP Semiconductors, USA
Dr. Zhou Yongkai
Thermo Fisher Scientific, Singapore
Mr. Dionaldo Zudhistira
Advanced Micro Devices, Singapore
Dr. DiBattista Michael
Varioscale, USA

Track 3: Case Studies on Fault Isolation

Chair
Ms. Angeline Phoa
Advanced Micro Devices, Singapore
Co-Chair
Dr. Hirotoshi Terada
Hamamatsu HPK, Japan
Mr. Dayanand Nagalingam
Globalfoundries, Singapore
Dr. Zhongling Qian
Infineon Technologies AG, Germany
Dr. Joshua Kevek
Intel Corporation, USA
Dr. Alfred Quah
Globalfoundries, Singapore
Mr. Vasanth Somasundaram
Advanced Micro Devices, Singapore
Dr. Chris Kang
Thermo Fisher Scientific, Korea
Mr. Venkat Krishnan Ravikumar
Advanced Micro Devices, Singapore
Mr. Gopinath Ranganathan
Advanced Micro Devices, Singapore
Mr. Jayant D'souza
Mentor, USA
Dr. Yan Pan
Advanced Micro Devices, USA
Dr. Rommel Estores
On Semiconductor, Belgium
Dr. Lesly Endrinal
Qualcomm, USA
Mr. Christian Burmer
Infineon Technologies AG, Germany
Prof. Christian Boit
Technical University Berlin, Germany
Dr. Mike Bruce
Consultant, USA
Mr. Joseph Caroselli
Advanced Micro Devices, USA
Mr. Kris Dickson
NXP Semiconductors, USA
Dr. William Lo
NVIDIA, USA

Track 4: Case Studies on Physical Failure Analysis

Chair
Mr. Vinod Narang
Advanced Micro Devices, Singapore
Co-Chair
Dr. Bow Jong-Shing
iST group, Taiwan
Dr. James Lee
Taiwan Semiconductor Manufacturing Company, Taiwan
Mr. Lim Soon Huat
Advanced Micro Devices, Singapore
Mr. Wilson Lee
Qualcomm, Singapore
Prof. Olivier Latry
University of Rouen Normandy, France
Mr. Tan Pik Kee
Globalfoundries, Singapore
Mr. Jiann Min Chin
Advanced Micro Devices, Singapore
Dr. Govindo J Syaranamual
Thermo Fisher Scientific, Singapore
Mr. Xue Ming
Infineon Technologies, Singapore
Dr. HaoHui Long
Huawei Technologies, China
Mr. Dakshi Srikanteswara
Advanced Micro Devices, Singapore
Dr. Shraddha Bodhe
Advanced Micro Devices, USA

Track 5: Package Level Failure Analysis

Chair
Dr. Susan Li
Infineon Technologies AG, USA
Co-Chair
Ms. Bernice Zee
Advanced Micro Devices, Singapore
Dr. Yan Li
Intel Corporation, USA
Mr. Frank Altmann
Fraunhofer Institute for Microstructure of Materials and Systems (IMWS), Germany
Dr. Li Liyi
Intel Corporation, USA
Dr. Shang Yang
Advantest, Singapore
Dr. Tang Jiaqi
JIACO Instruments, Netherlands
Dr. Zhang Xueren
Xilinx, Singapore
Ms. Qiu Wen
Advanced Micro Devices, Singapore
Dr. Cheryl Selvanayagam
Advanced Micro Devices, Singapore
Mr. Xue Ming
Infineon Technologies, Singapore

Track 6: Advanced Electrical Fault Isolation Techniques

Chair
Dr. Mike Bruce
Consultant, USA
Co-Chair
Mr. Kris Dickson
NXP Semiconductors, USA
Dr. Goh Szu Huat
Qualcomm, Singapore
Dr. William Lo
NVIDIA, USA
Mr. Joseph Caroselli
Advanced Micro Devices, USA
Dr. Keith Serrels
NXP Semiconductors, USA
Dr. Lesly Endrinal
Qualcomm, USA
Mr. Christian Bummer
Infineon Technologies AG, Germany
Dr. Joshua Kevek
Intel Corporation, USA

Track 7: Advanced Physical Failure Analysis Techniques

Chair
Dr. Christian Hobert
Globalfoundries, Germany
Co-Chair
Dr. Umberto Celano
University of Twente, Netherlands
Dr. Chen Changqing
Globalfoundries, Singapore
Dr. Chung Jayhoon
Texas Instruments, USA
Dr. Michel Bosman
NUS A*STAR IMRE, Singapore
Dr. Alok Ranjan
Chalmers University, Sweden
Dr. Yap Huei Hao
Intel Corporation, USA
Mr. Samuel Wei
Advanced Micro Devices, Singapore
Mr. Greg Johnson
Carl Zeiss, USA

Track 8: Product Test and Diagnostics

Chair
Dr. Goh Szu Huat
Qualcomm, Singapore
Co-Chair
Mr. Gopinath Ranganathan
Advanced Micro Devices, Singapore
Mr. Jayant D'souza
Mentor, USA
Dr. Yan Pan
Advanced Micro Devices, USA
Mr. Dakshi Srikanteswara
Advanced Micro Devices, Singapore
Dr. Rommel Estores
On Semiconductor, Belgium
Dr. Shraddha Bodhe
Advanced Micro Devices, USA

Track 9: Transistor and NVM Reliability

Chair
Dr. Felix Palumbo
National Technological University (UTN), Argentina
Co-Chair
Prof. Nagarajan Raghavan
Singapore University of Technology and Design, Singapore
Dr. Fei Hui
Technion-Israel Institute of Technology, Israel
Dr. Yuanyuan Shi
Interuniversity Microelectronics Centre (IMEC), Belgium
Dr. Wu Xing
East China Normal University, China
Dr. Liang Chudong
Micron Technology, USA
Dr. Subhakar Kalya
Singapore University of Technology and Design, Singapore
Prof. Mario Lanza
King Abdullah University of Science and Technology (KAUST), Saudi Arabia
Dr. Horng-Chih Lin
National Chiao Tung University, Taiwan
Prof. Chen Jiezhi
Shandong University, China
Dr. Stanislav Tyaginov
Interuniversity Microelectronics Centre (IMEC), Belgium
Prof. Zheng Chai
Xi'an Jiaotong University, China
Dr. Narendra Parihar
Interuniversity Microelectronics Centre (IMEC), Belgium
Dr. Subhali Subhechha
Interuniversity Microelectronics Centre (IMEC), Belgium
Prof. Wei Zhang
Liverpool John Moores University, UK
Prof. Zhigang Ji
Shanghai Jiao Tong University, China
Dr. Guo Xinfei
Univerity of Virginia, USA

Track 10: ESD, Latchup and Reliability for Space Applications

Chair
Dr. Guillaume Bascoul
National Centre for Space Studies (CNES), France
Co-Chair
Dr. Milova Paul
Globalfoundries, Singapore
Prof. Lin Chun-Yu
National Taiwan Normal University (NTNU), Taiwan
Dr. Ted Kolasa
Northrop Grumman Space Systems, USA
Dr. Nakul Pande
Apple Inc., USA
Dr. Natarajan Mahadeva Iyer
Allegro Systems, USA
Dr. Wei Liang
Globalfoundries, Singapore

Track 11: Interconnect and Packaging Reliability

Chair
Dr. Jeffrey Gambino
ON Semiconductor, USA
Co-Chair
Dr. Lim Yeow Kheng
National University of Singapore, Singapore
Dr. Hajdin Ceric
Vienna University of Technology, Austria
Dr. Christine Hau-Riege
Qualcomm, USA
Dr. Sasi Kumar Tippabhotla
A*STAR Institute of Microelectronics, Singapore
Dr. Galor Zhang
Facebook, Ireland
Dr. Kristof Croes
Interuniversity Microelectronics Centre (IMEC), Belgium

Track 12: Photonic Devices ( Lighting and Photovoltaic) Reliability and Failure Analysis

Chair
Prof. Massimo Vanzi
Cagliari University, Italy
Co-Chair
Mr. Alan Street
AMS AG, USA
Dr. Zhang Li
Huawei Technologies, China
Dr. Li Huiping
Huawei Technologies, China

Track 13: High Power Electronics/Wide Bandgap Device Reliability and Failure Analysis

Chair
Prof. Wu Tian-Li
National Chiao Tung University, Taiwan
Co-Chair
Dr. Wardhana A. Sasangka
Facebook, Ireland
Prof. Wu Wangran
Southeast University, China
Prof. Bhawani Shankar
Stanford University, USA
Prof. Matteo Meneghini
University of Padova, Italy
Prof. Zhang Jinping
University of Electronic Science and Technology of China, China
Dr. Gao Yu
Singapore - MIT Alliance for Research and Technology, Singapore
Dr. Matteo Borga
Interuniversity Microelectronics Centre (IMEC), Belgium

Track 14: Hardware Assurance

Chair
Prof. Christian Boit
Technical University Berlin, Germany
Co-Chair
Dr. Samuel Chef
Nanyang Technological University, Singapore
Prof. Giovanna Mura
Cagliari University, Italy
Dr. Shi Yiqong
Nanyang Technological University, Singapore
Prof. Shahin Tajik
Worcester Polytechnic Institute, USA
Dr. Sachin Taneja
Intel Corporation, USA
Dr. Franck Courbon
Cambridge University, UK