IPFA 2023

 

COMPLETED

See You in IPFA2024 at Marina Bay Sands, Singapore

 

For the first time, the 30th edition of the IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2023) is coming to Penang, Malaysia. IPFA will continue to focus on the fundamental understanding of the electrical and physical characterization techniques and associated technologies that assist in probing the nature of wear-out and failure in conventional and new CMOS devices, in turn resulting in improved knowhow of the physics of device/circuit/module failure that serves as a critical input for future design for reliability.

Date: 24 July 2023 – 27 July 2023

Venue: Bayview Beach Resort, Penang, Malaysia

Mode: Physical ONLY. No Online or Hybrid.

 

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“ IEEE reserves the right to exclude a paper from distribution after the conference, including IEEE Xplore® Digital Library, if the paper is not presented by the author at the conference.”

 

 

Keynote Speakers

Dr. Daniel Bien Chia Sheng

Flexible Solar Cells for Internet of Nano Things (IoNT) Applications 

NanoMalaysia Berhad, Malaysia

The growth of the Fourth Industrial Revolution has driven the requirement for interconnected smart devices where arrays of interconnected network of nanoscale and nanostructured devices are capable to compute, analyse and communicate with the wider internet and IoT infrastructure, hence enabling the Internet of Nano Things (IoNT) solutions. As low power, high performance nanoscale devices are integrated with the digital world, renewable energy such as solar cells will have a more important role in providing sustainable green energy to these solutions.

 

Prof. Dr. Zhiheng Huang

 A structure hierarchy descriptor enabling quantitative microelectronics failure analysis

Sun Yat-sen University, China

The field of physical and failure analysis has been facing increasing challenges as new architectures, circuits, devices, packaging, and materials emerge and are co-designed with a myriad of combinations and options. Failures in microelectronics can occur at different scales, from electronic to macro. The characterization tools in the field, therefore, must span multiple scales to identify root causes and isolate faults. Captured by characterization tools at different scales, digital images are critical for physical and failure analysis, from which only qualitative information to date, however, has been drawn and examined through empirical methods.

 

Professor. Ir. Dr. Cheong Kuan Yew

Failure Analysis of Engineering Materials in Embracing Megatrends: Bridging Solutions and Failures by Integrated Knowledge

Universiti Sains Malaysia, Malaysia

The World is driven by digitization and Internet-of-Things or Everything to meet the needs of global citizen and to resolve global concerns as advocated by United Nation’s 17 Sustainable Development Goals. The requirements of different engineering products, from the quality, reliability, health, and safety aspects, to support the demands through Industrial Revolution 4.0 are becoming more stringent.

 

Tutorial Speakers

 

Invited Speakers

 

Microelectronics Engineering Mid-Career Investigator Award Invited Talk at IPFA 2023

Professor Andrea Padovani from the “Enzo Ferrari” Engineering Department of the University of Modena and Reggio Emilia (Italy,  link to profile here), “In recognition of his outstanding contributions in the field of semiconductor device modeling, with special emphasis on the operation and reliability of logic and memory devices”.

 

Art of Failure Analysis Photo Contest Winners:

1st Prize

Title: Brain of FA

Jessica Villa (Analog Devices, Philippines)

 

2nd Prize

Title: Blossoms in Flight: Sakura Symphony

Cham Hooi Ying (ASE Electronics (M) Sdn Bhd, Malaysia)

 

3rd Prize

Title: Duck and Ring

Ruzita Kahar (Onsemi, Malaysia)

 

5 Consolation Prizes

1. Title: Party Cupcake

Luu Nguyen (PsiQuantum, USA)

2. Title: Newborn

Try YI Wang (MA-tek, Taiwan)

3. Title: Winter Wonderland

John Michael Saputil(Analog Devices, Philippines)

4. Title: Ghost

PeiHua Chen (MA-tek, Taiwan)

5. Title: Ferns on Gems & Crystals

Lee Guan Siong (SSMC, Singapore)

 

Best Poster Winners

Failure Analysis Category:

Optimization of Microwave Induced Plasma Etching Process for Decapsulation of Multi-Tier PCC Wire-Bonded Semiconductor Devices

Chiun Ning Liew, Wan Nurul Asmak Wan Hasnizam, Violeta Prodanovic and Jiaqi Tang
Intel Microelectronics, Malaysia

 

Reliability Category:

Hardware Security Assessment through Repair of Damaged Device
Siang Yee Sim, Qing Liu, Hwee Boon, Katherine Kor and Chee Lip Gan
Nanyang Technological University, Singapore

 

Best Oral Paper Winners

Failure Analysis Category:

Recovered Scan Failure Investigation and Failure Mechanism Determination
Loke Sheng Foo, Thin Wei Chua, Ley Teng Tan and Chik Hooi Liew
NXP Semiconductor Sdn. Bhd., Petaling Jaya, Malaysia

 

Reliability Category:

Security Evaluation of Microcontrollers in Smart Watches
Xiaomei Zeng, Qing Liu, Chung Tah Chua, Samuel Chef and Chee Lip Gan
Nanyang Technological University, Singapore

Event Videos

IPFA 2019

IPFA 2018

IPFA 2022 Highlights