Workshop Speakers

Dr. Hijaz Kamal Bin Hasnan

X-Ray Microscopy: Basics and Application

Department of Geology, Faculty of Science, Universiti Malaya

X-ray MicroCT provides non-destructive 3D images of samples across a broad range of disciplines. Advances in instrumentation and fast computing have enabled miniaturization, improved resolution, 3D visualization and analysis making this technology accessible to various industries and academia beyond synchrotron facilities. In this short tutorial we will introduce the basics of x-ray microscopy and demonstrate using virtual reality the various components in the instrument.


Mr. Longan (Joran) Jiao

Semiconductor FA applications with the XRM and AI based reconstruction techniques

Carl Zeiss (Shanghai) Co., Ltd.

In failure analysis, site specific defect characterization after fault isolation is challenging when the defects are hidden inside complex advanced packages. Targeting and creating access to a desired region of interest buried deep below the surface requires more than one technique – first identify the region of interest in the 3D volume followed by rapid large volume removal without creating artifacts with precise targeting of the feature of interest.


Ms. Bernice Zee

Semiconductor FA applications with the XRM and AI based reconstruction techniques

SMTS, Advanced Micro Devices (S) Pte Ltd

3D X-ray technique continues to play a critical role in semiconductor package failure analysis, primarily owing to its non-destructive nature and high-resolution capability. However, the rapid development of next generation packaging technologies has presented challenges to the current 3D X-ray microscopy (3D XRM) failure analysis workflow. This talk will cover some of the mainstream FA applications of 3D XRM as well as cover the advancements in the image reconstruction that will help alleviate resolution and time to result bottlenecks.


Sam Lin

A Total Failure Analysis Solution Toward Advanced Packaging Devices: From the surface to the inner hidden defects

Thermo Fisher Scientific, Hsinchu, TW

Moore’s law triggers the innovation of the semiconductor approximately every two years and the advanced packaging is no exception. Advanced packaging manages to place various functional chips into a package to meet Moore’s law and this technique comprises 2.5D, 3DIC, fan-out wafer-level packaging and system-in-package approaches.